![Chih-Ming Lai](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Chih-Ming Lai is currently the Chief Executive Officer of Jiangyin Changdian Advanced Packaging Co., Ltd. He previously served as the Chief Executive Officer & Executive Director of STATS ChipPAC Pte Ltd. from 2017 to 2018 and as a Non-Executive Non-Independent Director from 2015 to 2017.
He also held the position of Executive Vice President at JCET Group Co., Ltd.
| Unternehmen | Position | Beginn |
|---|---|---|
Jiangyin Changdian Advanced Packaging Co., Ltd.
 Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Manufactures and develops semiconductor chip and related products | Vorstandsvorsitzender | - |
| Unternehmen | Position | Ende |
|---|---|---|
| STATS CHIPPAC LTD. | Vorstandsvorsitzender | 27.09.2018 |
| STATS CHIPPAC LTD. | Direktor/Vorstandsmitglied | 22.02.2017 |
| JCET GROUP CO., LTD. | Corporate Officer/Principal | - |
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| Private Unternehmen | 3 |
|---|---|
STATS ChipPAC Pte Ltd.
 STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology Provides semiconductor test and packaging services | Electronic Technology |
JCET Group Co., Ltd.
 JCET Group Co., Ltd. SemiconductorsElectronic Technology Manufactures semiconductor packaging and electronic components | Electronic Technology |
Jiangyin Changdian Advanced Packaging Co., Ltd.
Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Manufactures and develops semiconductor chip and related products | Electronic Technology |
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