Jagdish G. Belani

Jagdish G.
Belani was appointed Senior Vice President of Package Materials.
Mr. Belani was Senior Vice President of Package Materials for Kulicke & Soffa Industries, Inc. from November 2005 to September 30, 2008.
He was Vice President of Wire Bonding and Corporate Marketing for Kulicke & Soffa Industries, Vice President of all the Business Units and Marketing and President of the Wire Bonding Division and XLAM.
Mr. Belani has been an Officer since joining Kulicke & Soffa Industries in April 1999 and was Vice President of Assembly and Packaging for Cypress Semiconductor Corporation.
He held various technical and managerial positions at National Semiconductor Corporation and a Wafer Fabrication Process Development Engineer of Advanced Micro Devices.
Mr. Belani received a B.
Tech in Chemical Engineering from IIT-Madras, an MS in Metallurgical and Materials Engineering from IIT-Chicago and a JD from the University of Santa Clara.