Aktive Positionen von Lewis Hwan
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
Mutual-Pak Technology Co., Ltd.
 Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Präsident | 01.09.2010 | - |
| Vorsitzender | - | - |
Karriereverlauf von Lewis Hwan
Statistik
International
| Taiwan | 2 |
Operativ
| Chairman | 1 |
| President | 1 |
Sektoral
| Electronic Technology | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Private Unternehmen | 1 |
|---|---|
Mutual-Pak Technology Co., Ltd.
Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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