Ling Man Pan
Direktor/Vorstandsmitglied bei Shenzhen Cau Technology Co. Ltd. /Shenzhen/
Aktive Positionen von Ling Man Pan
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Direktor/Vorstandsmitglied | 01.02.2011 | - |
| Independent Dir/Board Member | - | - |
Karriereverlauf von Ling Man Pan
Ehemalige bekannte Positionen von Ling Man Pan
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Direktor/Vorstandsmitglied | 15.05.2018 | 09.04.2021 |
| Independent Dir/Board Member | 15.05.2018 | 09.04.2021 | |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Direktor/Vorstandsmitglied | - | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Direktor/Vorstandsmitglied | - | - |
| Independent Dir/Board Member | - | - | |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Direktor/Vorstandsmitglied | 20.11.2009 | - |
| Independent Dir/Board Member | 20.11.2009 | - |
Ausbildung von Ling Man Pan
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Statistik
International
| China | 8 |
Operativ
| Director/Board Member | 5 |
| Independent Dir/Board Member | 4 |
| Masters Business Admin | 1 |
Sektoral
| Electronic Technology | 3 |
| Consumer Services | 3 |
| Health Technology | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Börsennotierte Unternehmen | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Private Unternehmen | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
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