![Daniel L. Donabedian](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Daniel L. Donabedian
Vorstandsvorsitzender bei Invensas Bonding Technologies, Inc.
Aktive Beziehungen
Name | Geschlecht | Alter | Unternehmensverbindungen | Zusammenarbeit |
---|---|---|---|---|
Paul M. Enquist | M | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Jon Kirchner | M | 56 |
Tessera Technologies LLC
![]() Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | - |
E. Wayne Holden | M | 67 |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Steven L. Teig | M | - |
Tessera Technologies LLC
![]() Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | 9 Jahre |
Mitch Mumma | M | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
David P. Rizzo | M | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Peter van Deventer | M | - |
Tessera Technologies LLC
![]() Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | - |
Richard P. Gianni | M | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Christopher Sanders | M | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Kathy Cook | F | - |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | - |
Chuck White | M | - |
Tessera Technologies LLC
![]() Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | 20 Jahre |
Beziehungs-Chart
Beziehungen zu mehreren Unternehmen
Statistik
Land | Beziehungen | % des Gesamten |
---|---|---|
Vereinigte Staaten | 11 | 100,00% |
Alter der Beziehungen
Aktive
Vergangene
Herr
Frau
Aufsichtsräte
Führungskräfte
Ursprung der Beziehungen
- Börse
- Insiders
- Daniel L. Donabedian
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