Shi Lian Wang
Keine laufenden Positionen mehr
Profil
Shi Lian Wang worked as a Controller at ChipPAC, Inc. from 1998 to 2001.
From 2002 to 2004, he was the Chief Financial Officer at Signia Technologies Co., Ltd.
He then worked as the Chief Financial Officer and Executive Vice President at Spreadtrum Communications, Inc. from 2004 to 2007.
From 2008 to 2014, he was the Chief Financial Officer and Head-Investor Relations at Trina Solar Co., Ltd.
He also worked as the Chief Financial Officer at VNET Group, Inc. from 2011 to 2018.
Mr. Wang's education includes an undergraduate and graduate degree from Fudan University, an MBA from the University of Wisconsin, and a graduate degree from Brown University.
Ehemalige bekannte Positionen von Shi Lian Wang
Unternehmen | Position | Ende |
---|---|---|
VNET GROUP, INC. | Finanzdirektor/CFO | 09.01.2018 |
TRINA SOLAR CO., LTD. | Finanzdirektor/CFO | 10.01.2014 |
SPREADTRUM COMMUNICATIONS, INC (ADR) | Finanzdirektor/CFO | 01.01.2007 |
Signia Technologies Co., Ltd.
Signia Technologies Co., Ltd. SemiconductorsElectronic Technology Part of Uphill Investment Co., Signia Technologies Co., Ltd. is a Taiwanese company that manufactures wireless chipsets. The company is based in Taipei, Taiwan. Signia Technologies Co. was acquired by Integrated Silicon Solution, Inc., part of Uphill Investment Co. from December 08, 2015 on December 21, 2004 for $7.96 million. | Finanzdirektor/CFO | 01.01.2004 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Comptroller/Controller/Auditor | 01.01.2001 |
Ausbildung von Shi Lian Wang
Brown University | Graduate Degree |
University of Wisconsin | Masters Business Admin |
Fudan University | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Börsennotierte Unternehmen | 3 |
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TRINA SOLAR CO., LTD. | Electronic Technology |
VNET GROUP, INC. | Technology Services |
GALAXYCORE INC. | Electronic Technology |
Private Unternehmen | 3 |
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ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Electronic Technology |
Signia Technologies Co., Ltd.
Signia Technologies Co., Ltd. SemiconductorsElectronic Technology Part of Uphill Investment Co., Signia Technologies Co., Ltd. is a Taiwanese company that manufactures wireless chipsets. The company is based in Taipei, Taiwan. Signia Technologies Co. was acquired by Integrated Silicon Solution, Inc., part of Uphill Investment Co. from December 08, 2015 on December 21, 2004 for $7.96 million. | Electronic Technology |
Spreadtrum Communications, Inc.
Spreadtrum Communications, Inc. SemiconductorsElectronic Technology Spreadtrum Communications, Inc. operates as a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones, and other consumer electronics products. It supports 2G, 3G, and 4G wireless communications standards. The firms solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. The company was founded by Da Tong Chen, Ren Yong Fan, Jin Ji, and Ping Wu in April 2001 and is headquartered in Shanghai, China. | Electronic Technology |