![Lars A. Pedersen](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Lars A. Pedersen
Technik-/Wissenschafts-/F&E-Leiter bei TPACK A/S
Profil
Lars A.
Pedersen is currently the Chief Technology Officer at TPACK A.
Previously, he worked as a Principal at Infinera Optical Holding, Inc. and DSC Communications Corp.
Mr. Pedersen received an undergraduate degree from Copenhagen Business School and a graduate degree from Technical University of Denmark.
Aktive Positionen von Lars A. Pedersen
Unternehmen | Position | Beginn |
---|---|---|
TPACK A/S
![]() TPACK A/S Packaged SoftwareTechnology Services TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field. Since 2001, TPACK has been providing some of the world's largest telecommunication equipment manufacturers with leading edge technology and solutions for efficient packet transport. Specifically, TPACK provides the chip solutions and the supporting software that implement the intelligence in telecom systems. TPACK's experience and expertise in both data and telecom networks has proven to be decisive in TPACK's success to date. | Technik-/Wissenschafts-/F&E-Leiter | - |
Ehemalige bekannte Positionen von Lars A. Pedersen
Unternehmen | Position | Ende |
---|---|---|
TELLABS, INC. | Corporate Officer/Principal | - |
DSC Communications Corp. | Corporate Officer/Principal | - |
Ausbildung von Lars A. Pedersen
Technical University of Denmark | Graduate Degree |
Copenhagen Business School | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Private Unternehmen | 3 |
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TPACK A/S
![]() TPACK A/S Packaged SoftwareTechnology Services TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field. Since 2001, TPACK has been providing some of the world's largest telecommunication equipment manufacturers with leading edge technology and solutions for efficient packet transport. Specifically, TPACK provides the chip solutions and the supporting software that implement the intelligence in telecom systems. TPACK's experience and expertise in both data and telecom networks has proven to be decisive in TPACK's success to date. | Technology Services |
DSC Communications Corp. | Electronic Technology |
Infinera Optical Holding, Inc.
![]() Infinera Optical Holding, Inc. Telecommunications EquipmentElectronic Technology Infinera Optical Holding, Inc. designs and develops telecommunications networking products. The firm serves telecom service providers, independent operating companies, multiple system operator cable companies, enterprises and government agencies. The company was founded by Michael J. Birck in 1975 and is headquartered in Naperville, IL. | Electronic Technology |