Ingu Yin Chang

Vorstandsvorsitzender bei Vertical Circuits, Inc.

Electronic Technology

Consumer Services

Profil

Ingu Yin Chang currently works at Vertical Circuits, Inc., as Chief Executive Officer from 2011.
Mr. Chang also formerly worked at LSI Corp., as Principal and Amkor Technology, Inc., as Vice President-Sales & Marketing.
Mr. Chang received his graduate degree from the University of California, Berkeley.

Aktive Positionen von Ingu Yin Chang

Unternehmen	Position	Beginn
Vertical Circuits, Inc. Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.	Vorstandsvorsitzender	09.08.2011

Alle aktiven Positionen von Ingu Yin Chang

Ehemalige bekannte Positionen von Ingu Yin Chang

Unternehmen	Position	Ende
LSI CORP	Corporate Officer/Principal	-
AMKOR TECHNOLOGY, INC.	Vertrieb & Marketing	-

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Ausbildung von Ingu Yin Chang

University of California, Berkeley

Graduate Degree

Erfahrungen
Besetzte Positionen

Aktive

Inaktive

Börsennotierte Unternehmen

Private Unternehmen

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Beziehungen

Beziehungen ersten Grades

Unternehmen ersten Grades

Herr

Frau

Aufsichtsräte

Führungskräfte

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Unternehmensverbindungen

Börsennotierte Unternehmen	1
AMKOR TECHNOLOGY, INC.	Electronic Technology

Private Unternehmen	2
Vertical Circuits, Inc. Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.	Electronic Technology
LSI Corp. LSI Corp. Electronic ComponentsElectronic Technology LSI Corp. designs, develops, and markets high-performance storage and networking semiconductors. Its products include custom and standard product integrated circuits that are used in disk drives, solid state drives, high-speed communications systems, computer servers, storage systems, and personal computers. The company was founded on November 6, 1980 and is headquartered in San Jose, CA.	Electronic Technology