Osamu Okada
Direktor/Vorstandsmitglied bei Casio Micronics Co., Ltd.
Ursprung des Netzwerks ersten Grades von Osamu Okada
Einheit | Art der Einheit | Industrie | |
---|---|---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.
4
| Subsidiary | Semiconductors | 4 |
Unternehmensgrafik - zweiten Grades
Beziehungen zu mehreren Unternehmen
Unternehmensverbindungen über das persönliche Netzwerk von Osamu Okada
Unternehmen | Sektor | Verknüpfte Personen | Hauptposition |
---|---|---|---|
CASIO COMPUTER CO., LTD. | Electronics/Appliances | Director/Board Member |
Statistik
International
Japan | 2 |
Sektoral
Consumer Durables | 2 |
Operativ
Director/Board Member | 5 |
Corporate Officer/Principal | 2 |
President | 1 |
Independent Dir/Board Member | 1 |
Chief Administrative Officer | 1 |
Am stärksten vernetzte Beziehungen
- Börse
- Insiders
- Osamu Okada
- Unternehmensverbindungen