Jay B. Grover
Keine laufenden Positionen mehr
Karriereverlauf von Jay B. Grover
Ehemalige bekannte Positionen von Jay B. Grover
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 01.05.2019 | 27.08.2021 |
| SUNEDISON INC | Corporate Officer/Principal | 01.01.2010 | 01.01.2017 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Geschäftsführer | 01.01.2005 | 01.01.2010 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Präsident | 01.01.1997 | 01.01.2005 |
Statistik
International
| Vereinigte Staaten | 5 |
Operativ
| Corporate Officer/Principal | 2 |
| Chief Operating Officer | 1 |
| President | 1 |
Sektoral
| Electronic Technology | 3 |
| Technology Services | 2 |
| Utilities | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Börsennotierte Unternehmen | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Private Unternehmen | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
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